Samsung Galaxy Z Fold 3 and Galaxy Z Flip 3 design changes revealed in new renders | 91mobiles.com

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Rumours about Samsung’s upcoming foldable smartphones — Galaxy Z Fold 3 and Galaxy Z Flip 3 — have begun trickling in close to its alleged August launch. Renowned leaker Evan Blass has now posted fresh renders showcasing the Galaxy Z Fold 3 and Z Flip 3 in all their glory. While they don’t tell us a whole lot about their specs, we can see some minor changes in design, especially for the Galaxy Z Fold 3. Its under-display selfie camera seems to have been highlighted, for some reason. We can expect it to blend into the screen completely on the final product. Furthermore, it also shows us the Galaxy Z Flip 3’s tiny secondary display and dual-rear camera setup.

Blass also posted a second, more detailed image of the Samsung Galaxy Z Fold 3 that pretty much confirms a ‘Fold Edition’ S Pen support for the foldable. The actual S Pen in question is significantly larger than the one found on the Galaxy Note series. It could, in all likelihood, be similar to the one that we get with Samsung’s tablets. This also puts to rest rumours about the touch-based buttons on the foldable, as the physical volume rocker and power button can be seen clearly. Lastly, the render also sheds light on the Galaxy Z Fold 3’s triple rear camera layout. Whether or not Samsung will include it in the retail packaging remains to be seen. 

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The Samsung Galaxy Z Flip 3 can be seen in a new dual-tone finish in the official-looking render. Even the external display panel looks bigger than the one we have seen in the previous generation, and there are dual camera sensors on the exterior.

Samsung is expected to unveil the Galaxy Z Fold 3, Galaxy Z Flip 3, Galaxy Watch 4 and Galaxy Watch Active 4 sometime in August. Initially, the Galaxy S21 FE was supposed to join it, but that launch reportedly has been pushed back to October 2021 due to the global semiconductor shortage. It seems that the Galaxy Z Fold 3 is immune to the said shortage, as it is expected to pack the shiny new (and unannounced) Snapdragon 888+ chipset.

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